This high-performance vibration monitoring sensor is manufactured based on MEMS (Micro-Electro-Mechanical Systems) processing technology. Its sensitive structure adopts a sandwich layout, where a flat plate is suspended via cantilever beams.
Quote NowThis high-performance vibration monitoring sensor is manufactured based on MEMS (Micro-Electro-Mechanical Systems) processing technology. Its sensitive structure adopts a sandwich layout, where a flat plate is suspended via cantilever beams. Differential capacitance is formed by fixed electrodes and movable electrodes.
When subjected to acceleration, the flat proof mass displaces, breaking the balance of differential capacitance. The sensor outputs a voltage signal whose amplitude is proportional to the applied acceleration.
Closed-loop MEMS capacitive sensor
Supply Voltage: 5V±3% or 7–24V
Operating Current: ≤25mA (3-axis model)
Output Type: Differential analog output & digital output
Noise Floor: ≤2.5μgrms/√Hz
Dynamic Range: ≥110dB (for reference only)
Bandwidth: ≥200Hz (Typ., -3dB cut-off)
Measurement Range: ±2g, ±3g, ±10g, ±30g
Non-linearity: 0.1% FS (Typ., FS = Full Scale)
Dimension: 38.5 × 35.5 × 21 mm
Operating Temperature: -40 ~ +85℃
Seismic monitoring
Structural & building health monitoring
Industrial and process control
Strong earthquake observation
High-speed rail & subway
Geophysical exploration
